MSc Y. Hopf
Electronic Instrumentation (EI), Department of Microelectronics
Expertise: Ultrasound ASICs, SAR Analog to digital convertersThemes: Ultrasound ASICs
Yannick Hopf was born in Seligenstadt, Germany in 1991. He received his B.Sc. and M.Sc. qualification in electrical engineering with specialization in integrated systems from Technische Universität Darmstadt, Germany, in 2014 and 2017 respectively. His performance was honoured with the price for best degree in his year.
Since June 2018, Mr. Hopf is a Ph.D. candidate at the Electronic Instrumentation Laboratory of TU Delft where he works towards enabling 3D intra-cardiac echography from the tip of a catheter. His current research interests include high voltage circuit design and ultrasound ASICs.
3D Intra-Cardiac Echography
In this project, novel transducers, integrated electronics and visualization methods will be developed that will enable real-time 3D ultrasound imaging at the tip of a catheter
- A Compact Integrated High-Voltage Pulser Insensitive to Supply Transients for 3D Miniature Ultrasound Probes
Yannick M. Hopf; Boudewine Ossenkoppele; Mehdi Soozande; Emile Noothout; Zu-Yao Chang; Hendrik J. Vos; Johan G. Bosch; Martin D. Verweij; Nico de Jong; Michiel A. P. Pertijs;
IEEE Solid-State Circuits Letters,
pp. 1--1, 2022. DOI: 10.1109/lssc.2022.3180071
Abstract: ...In this paper, a compact high-voltage (HV) transmit circuit for dense 2D transducer arrays used in 3D ultrasonic imaging systems is presented. Stringent area requirements are addressed by a unipolar pulser with embedded transmit/receive switch. Combined with a capacitive HV level shifter, it forms the ultrasonic HV transmit circuit with the lowest reported HV transistor count and area without any static power consumption. The balanced latched-based level shifter implementation makes the design insensitive to transients on the HV supply caused by pulsing, facilitating application in probes with limited local supply decoupling, such as imaging catheters. Favorable scaling through resource sharing benefits massively arrayed architectures while preserving full individual functionality. A prototype of 8 x 9 elements was fabricated in TSMC 0.18 μm HV BCD technology and a 160 μm x 160 μm PZT transducer matrix is manufactured on the chip. The system is designed to drive 65 V peak-to-peak pulses on 2 pF transducer capacitance and hardware sharing of 6 elements allows for an area of only 0.008 mm2 per element. Electrical characterization as well as acoustic results obtained with the 6 MHz central frequency transducer are demonstrated.
- A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes
Y. Hopf; B. Ossenkoppele; M. Soozande; E. Noothout; Z. Y. Chang; C. Chen; H. J. Vos; J. G. Bosch; M. D. Verweij; N. de Jong; M. A. P. Pertijs;
In Dig. Techn. Papers IEEE International Solid-State Circuits Conference (ISSCC),
February 2022. Accepted.
- Feasibility of High Frame Rate 3-D Intracardiac Echography using Fan-Beam Transmissions
M. Soozande; B. Ossenkoppele; Y. Hopf; M. A. P. Pertijs; M. D. Verweij; H. J. Vos; J. G. Bosch; N. de Jong;
In Proc. IEEE International Ultrasonics Symposium (IUS),
IEEE, pp. 1-4, October 2019. (Accepted).
Last updated: 5 Jun 2018